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Learn More About X-ray Inspection

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Sometimes, we run into issues around the board, and today on X-ray University, we’re taking a closer look at these X-ray images. The video reveals the residue left around the board by these fans, potentially causing tricky problems down the line. Join us as we explore what these X-ray images tell us about the fans and how they connect to the PCB.

We’ll break down the details, from the fan’s center pad to the signal pads and filler. The video emphasizes the importance of proper soldering, highlighting issues that may arise when the solder doesn’t melt completely. These problems, like tiny dots in the X-ray, can lead to short circuits, causing headaches for both you and your customers. Stay tuned as we head to the demo room to showcase the actual X-ray machine and demonstrate how it all comes together.

From time to time, we encounter issues, observing their impact around the board. In this context, we present an X-ray image of a Cure fan, illustrating potential residue concerns. Such residue can lead to challenging problems if not addressed promptly. The X-ray provides insight into the appearance of a Cure fan.

Moving on, we’ll transition to our demo room to showcase the actual X-ray machine. Before that, let’s establish a mental image of the X-ray. The illustration includes a cube, representing a fan in a half-moon shape. A portion of the drawing symbolizes the solder, completing the picture.

This solder connects the Cube fan’s pad to the board. The top view shows the fan on the PCB, with the pad located accordingly. The solder extends to form a connection between the Cube fan and the PCB. It’s crucial to note that the pad of the Cube fan may wrap around the component, depending on the specific part.

Examining a specific case, we focus on the large center pad of the Cube fan, soldered onto the board, along with signal pads and filler. Issues arise when the solder isn’t properly used or doesn’t melt entirely. This can be due to insufficient temperature during the reflow cycle or not maintaining the required temperature for an adequate duration.

The density of solder makes it easily visible in X-ray images, appearing as dark dots, especially around the edges of components. In the following example, we’ll demonstrate one of our test boards to illustrate the potential dangers. Over time, these dots can accumulate and lead to short circuits, often in inconvenient locations.

Short circuits can manifest as the most challenging issues to detect, causing significant headaches for both you and your customers. Therefore, we’ll use X-ray imaging to reveal these shorts before shipping the product or deploying it in the field.

In the video demonstration, we focus on the Cube fan, showcasing its package, pad, and connection to the PCB. The center pad, crucial for thermal dissipation and electrical grounding, is highlighted. Solid pieces of solder can cause substantial problems on the board. The video further illustrates the tiny spheres of solder that didn’t properly wet, potentially leading to connectivity issues.

These spheres can migrate on the PCB’s surface, posing risks, especially when they accumulate near component edges. Careful consideration is necessary during the reflow and cleaning processes to ensure proper wetting of the solder to both component pads and the PCB surface.

In summary, the importance of X-ray imaging in your quality control process cannot be overstated. It plays a critical role in identifying potential issues before they escalate. We appreciate your attention, and don’t forget to subscribe for more insights. Feel free to leave comments if there are specific topics you’d like us to cover in future videos. Thank you.